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SMBJ12AON 600 Watt Peak Power Zener Transient Voltage Suppressor
Unidirectional*
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The SMBJ12AON is designed to protect voltage sensitive components from high voltage, high energy transients. This device has excellent clamping capability, high surge capability, low zener impedance and fast response time. The SMBJ12AON is ideally suited for use in computer hard disk drives, communication systems, automotive, numerical controls, process controls, medical equipment, business machines, power supplies, and many other industrial/consumer applications.
Specification Features:
PLASTIC SURFACE MOUNT ZENER OVERVOLTAGE TRANSIENT SUPPRESSOR 600 WATT PEAK POWER
* Working Peak Reverse Voltage Range - 12 V * Peak Power - 600 Watts @ 1 ms at Maximum Clamp Voltage @ * * * * * *
Peak Pulse Current ESD Rating of Class 3 (>16 KV) per Human Body Model ESD Rating IEC 61000 -4.2 Level 4 Low Leakage < 5 mA at 12 V UL 497B for Isolated Loop Circuit Protection Response Time is Typically < 1 ns Pb-Free Package is Available
Cathode
Anode
SMB CASE 403A PLASTIC
MARKING DIAGRAM
YWW LEM Y WW LEM = Year = Work Week = Specific Device Code
Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic FINISH: All external surfaces are corrosion resistant and leads are
readily Solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260C for 10 Seconds
LEADS: Modified L-Bend providing more contact area to bond pads POLARITY: Cathode indicated by polarity band MOUNTING POSITION: Any ABSOLUTE MAXIMUM RATINGS
Please See the Table on the Following Page
ORDERING INFORMATION
Device { SMBJ12AONT3 SMBJ12AONT3G Package SMB SMB (Pb-Free) Shipping 2500/Tape & Reel 2500/Tape & Reel
The "T3" suffix refers to a 13 inch reel. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
(c) Semiconductor Components Industries, LLC, 2005
1
July, 2005 - Rev. 0
Publication Order Number: SMBJ12AON/D
SMBJ12AON
ABSOLUTE MAXIMUM RATINGS
Rating Peak Power Dissipation (Note 1) @ TL = 25C, Pulse Width = 1 ms DC Power Dissipation @ TL = 75C Measured Zero Lead Length (Note 2) Derate Above 75C Thermal Resistance from Junction to Lead DC Power Dissipation (Note 3) @ TA = 25C Derate Above 25C Thermal Resistance from Junction to Ambient Operating and Storage Temperature Range Symbol PPK PD RqJL PD RqJA TJ, Tstg Value 600 3.0 40 25 0.55 4.4 226 -65 to +150 Unit W W mW/C C/W W mW/C C/W C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. 10 X 1000 ms, non-repetitive at maximum IPPM and VCM, see electrical characteristics. 2. 1 square copper pad, FR-4 board 3. FR-4 board, using ON Semiconductor minimum recommended footprint, as shown in 403A case outline dimensions spec.
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted, VF = 3.5 V Max. @ IF (Note 4) = 30 A)
Symbol IPP VC VRWM IR VBR IT IF VF Parameter Maximum Reverse Peak Pulse Current Clamping Voltage @ IPP Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM Breakdown Voltage @ IT Test Current Forward Current Forward Voltage @ IF VC VBR VRWM
I IF
IR VF IT
V
IPP
4. 1/2 sine wave (or equivalent square wave), PW = 8.3 ms, non-repetitive duty cycle.
Uni-Directional TVS
ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise noted)
Parameter Zener Voltage (Note 5) Reverse Leakage Current Clamping Voltage Absolute Maximum Clamping Voltage Conditions IT = 1 mA VRWM = 12 V IPP = 17.5 A (Per Figures 1 & 2) IPPM = 30.2 A (Per Figure 3, Note 6) Symbol VZ IR VC VCM Min 13.2 Typ 13.75 Max 14.3 5.0 15.6 19.9 Unit V mA V V
5. VZ measured at pulse test IT at an ambient temperature of 25C. 6. Absolute Maximum Peak Current, IPPM.
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SMBJ12AON
100 90 % OF PEAK PULSE CURRENT 80 70 60 50 40 30 20 10 0 0 6.5 t, TIME (ms) tP tr PEAK VALUE IRSM @ 1.6 ms % OF PEAK PULSE CURRENT PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 1.6 ms HALF VALUE IRSM/2 @ 6.5 ms 100 90 80 70 60 50 40 30 20 10 0 0 20 40 t, TIME (ms) 60 80 tP tr PEAK VALUE IRSM @ 8 ms PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 ms HALF VALUE IRSM/2 @ 20 ms
Figure 1. 1.6 x 6.5 ms Pulse Waveform
Figure 2. 8 x 20 ms Pulse Waveform
tr 10 ms 100 VALUE (%) PEAK VALUE - IPP
PEAK PULSE DERATING IN % OF PEAK POWER OR CURRENT @ T = 25 C A
PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAYS TO 50% OF IPP.
160 140 120 100 80 60 40 20 0 0 25 50 75 100 125 150
50 tP 0 0 1
I HALF VALUE - PP 2
2 t, TIME (ms)
3
4
TA, AMBIENT TEMPERATURE (C)
Figure 3. 10 x 1000 ms Pulse Waveform
Figure 4. Pulse Derating Curve
TYPICAL PROTECTION CIRCUIT
Zin
Vin
LOAD
VL
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SMBJ12AON
APPLICATION NOTES
RESPONSE TIME
In most applications, the transient suppressor device is placed in parallel with the equipment or component to be protected. In this situation, there is a time delay associated with the capacitance of the device and an overshoot condition associated with the inductance of the device and the inductance of the connection method. The capacitive effect is of minor importance in the parallel protection scheme because it only produces a time delay in the transition from the operating voltage to the clamp voltage as shown in Figure 5. The inductive effects in the device are due to actual turn-on time (time required for the device to go from zero current to full current) and lead inductance. This inductive effect produces an overshoot in the voltage across the equipment or component being protected as shown in Figure 6. Minimizing this overshoot is very important in the application, since the main purpose for adding a transient suppressor is to clamp voltage spikes. The SMB series have
a very good response time, typically < 1 ns and negligible inductance. However, external inductive effects could produce unacceptable overshoot. Proper circuit layout, minimum lead lengths and placing the suppressor device as close as possible to the equipment or components to be protected will minimize this overshoot. Some input impedance represented by Zin is essential to prevent overstress of the protection device. This impedance should be as high as possible, without restricting the circuit operation.
DUTY CYCLE DERATING
If the duty cycle increases, the peak power must be reduced as indicated by the curves of Figure 7. Average power must be derated as the lead or ambient temperature rises above 25C. The average power derating curve normally given on data sheets may be normalized and used for this purpose.
V
Vin (TRANSIENT)
V
OVERSHOOT DUE TO INDUCTIVE EFFECTS
Vin (TRANSIENT) VL
VL
Vin td tD = TIME DELAY DUE TO CAPACITIVE EFFECT t
t
Figure 5.
Figure 6.
1 0.7 0.5 DERATING FACTOR 0.3 0.2 0.1 0.07 0.05 0.03 0.02 10 ms 0.01 0.1 0.2 0.5 1 2 5 10 D, DUTY CYCLE (%) 20 50 100 100 ms PULSE WIDTH 10 ms
1 ms
Figure 7. Typical Derating Factor for Duty Cycle
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SMBJ12AON
UL RECOGNITION The entire series has Underwriters Laboratory Recognition for the classification of protectors (QVGV2) under the UL standard for safety 497B and File #116110. Many competitors only have one or two devices recognized or have recognition in a non-protective category. Some competitors have no recognition at all. With the UL497B recognition, our parts successfully passed several tests including Strike Voltage Breakdown test, Endurance Conditioning, Temperature test, Dielectric Voltage-Withstand test, Discharge test and several more. Whereas, some competitors have only passed a flammability test for the package material, we have been recognized for much more to be included in their Protector category.
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SMBJ12AON
PACKAGE DIMENSIONS
S A
SMB DO-214AA CASE 403A-03 ISSUE D
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
D
B
C
INCHES DIM MIN MAX A 0.160 0.180 B 0.130 0.150 C 0.075 0.095 D 0.077 0.083 H 0.0020 0.0060 J 0.006 0.012 K 0.030 0.050 P 0.020 REF S 0.205 0.220
MILLIMETERS MIN MAX 4.06 4.57 3.30 3.81 1.90 2.41 1.96 2.11 0.051 0.152 0.15 0.30 0.76 1.27 0.51 REF 5.21 5.59
K
P
J
H
SOLDERING FOOTPRINT*
0.089 2.261
0.108 2.743
inches mm
0.085 2.159 *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: N. American Technical Support: 800-282-9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Phone: 81-3-5773-3850 Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.
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SMBJ12AON/D

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